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Details of Exhibition


  • Process equipment (sputtering, evaporation, MBE, CVD, ALD, etching, etc.)

  • Vacuum components (Vacuum flanges, pumps, gauges, plasma source etc.)

  • Plasma diagnostic equipment 

  • Film characterization equipment 

  • Simulation programs

  • Related materials and components (Sputtering target, etc.)

Exhibitors list at the past ISSP meetings




Dates & Times

  • July 3 and 4 :  From 17:00 to 19:00 (Tentative)

  • July 5:  From 15:00 to 17:00 (Tentative)

*Poster session is held at the same time and location.

*It will not overlap with Symposium sessions, so that the all participants can join the exhibition session.

Exhibit fee120,000 JPY/single booth (including taxes)

*The fee includes the exhibit fee 100,000 JPY + registration fee for 1 person 20,000 JPY

*For extra two persons of exhibitor, the registration fee is \20,000 per person.  

From the 4th person and up, please register as a normal participant.

Booth Configuration

One unit of exhibition booth consists of...

  • Panel of 180 cm (width) x 200 cm (height)

  • Desk of 180 cm (width) x 60 cm (depth) x 70 cm (height)

*The total weight of exhibiting materials on the desk should be less than 10 kg.

*You may use multiple exhibition units by paying additional fee.  

*Utilities of electrical power are available for personal computer use (2 A, AC100 V).

*If you would like to make any special exhibition, please feel free to contact us.

Other features

  • Free advertisement in the program booklet
    1 page per unit monochrome advertisement on the programs (print media) for free.

  • Link with your company logo at our ISSP Website
    We prepare a link to your home website on our web page with your company logo.

  • Short CM presentation during coffee break
    CM slide presentation will be available during the break time of oral session. (Details will be informed later.)

How to apply ?
Please apply from the following Online Exhibitors Application Form.

Application Deadline: May 17, 2024

  • Please upload the image file of your company logo, if you wish to make link of your company's home page on the ISSP2024 web site.

  • If you wish to apply the free advertisement on the program booklet and the short CM presentation, please upload a PDF file (advertisement, font embedding, one page per unit) and pptx file (CM slide) from the application site. 

Other Notes

  • Description language is English.

  • At least one person is required to present and explain at the booth. 

  • The carriage of all the exhibiting materials is to be made by yourself.

  • Please keep your exhibition material until the closing of ISSP2024.


ISSP2024 Secretariat,
Tokyo Metropolitan University

6-6, Asahigaoka, Hino-shi, Tokyo 191-0065, JAPAN
TEL: +81-42-585-8628


Online Application Form Coming Soon
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