History and Our Mission
The International Symposium on Sputtering and Plasma Processes (ISSP) was established in 1991, with its first edition focusing on the theme of "Reactive Sputtering". At that time, innovative approaches were emerging to enhance both the deposition rate and process stability of reactive sputtering, making it a pivotal moment in the field. Since then, our strong mission of ISSP is to provide communication platforms bridging between basic science & industrial application. ISSP has been held biennially, evolving into a leading forum for the discussion of the latest topics and trends in sputtering and plasma processes. Each symposium serves as a dynamic platform where experts from academia and industry gather to exchange cutting-edge knowledge and explore new directions in the field.
ISSP is distinguished by two unique characteristics. First, its program committee is composed primarily of members from related industries, ensuring that the symposium maintains a strong focus on practical applications and industrial relevance. Second, all oral presenters—including invited speakers—are required to also present their work in the poster session held on the same day. This format fosters in-depth discussions and provides attendees with rare opportunities to engage directly with the speakers, beyond the constraints of formal presentations. After being held three consecutive times in Kyoto, ISSP returned to Kanazawa for its 14th & 15th edition in 2017 and 2019 —a symbolic return to one of its most cherished venues. After COVID19, physical meeting was finally coming back in 2024 at Kyoto.
Our history will be continued to 2026...We warmly welcome engineers and researchers from around the world who are interested in sputtering and plasma technologies to join us at ISSP and take part in this inspiring and interactive symposium!
ISSP symposium records
16th: ISSP2022 in Sapporo ( in IVC22)