ISSP2026 Symposium Summary
1. Attendees
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Total registrants : 261 (General: 243, Exhibitors:18)
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Countries:
Japan 138, Taiwan 36, Korea 21, Germany 6, United States 6,
Czech Republic 5, France 4, Belgium 3, Sweden 3, Singapore 2,
Slovakia 2, China 2, Hong Kong 2, Netherlands 2, Russia 2, Austria 1, Iceland 1, India 1, Kazakhstan 1, Mexico 1, Poland 1, Switzerland 1, Thailand 1, United Kingdom 1
2. Presentations & Exhibitions
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Invited presentations: 11
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Industrial presentations: 9
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Oral presentations: 24
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Poster presentations: 94
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Exhibition : 18 companies
3. Program
5. ISSP Nakagawara Awards Winners in ISSP2026
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- Best Paper Award
The Best Paper Award are intended to honor and encourage young researchers whose academic achievements and current research demonstrate a high level of excellence and distinction. Eligible candidates must be under 45 years of age and/or within 15 years after receiving their Ph.D. degree. Periods related to major life events, such as parental leave, childcare, family care, or other comparable circumstances, may be excluded from the calculation of eligibility, where applicable.
Erdong Chen
(Tokyo Metropolitan University, Japan)
"Multi-pulse HiPIMS as a New Route to Stable Reactive VO₂ Sputtering"
- Student Awards
The Student Awards are intended to honor and encourage undergraduate and graduate students whose research achievements and presentations demonstrate a high level of excellence and distinction.For the Student Awards, the evaluation will be conducted based on poster presentations.
Farzaneh Farahani
(Gent University, Belgium)
"Tuning the tungsten thin film phase composition during magnetron sputter deposition"
Jocelyn Kezia Sutadharma
(Kyushu University, Japan)
"Substantial Improvement of Crystalline Quality in Sputtered Zn1-xMgxO Films on Sapphire Enabled by ZnO(N) Buffers"
Koki Karikomi
(Tokyo Metropolitan University, Japan)
"Stress Evolution in GaN Thin Films Deposited by HiPIMS:Insights from Plasma Mass Spectrometry"
6. Special Acknowledgements
Special Tutorials
Prof. Jochen M. Schneider
Chair and Professor of Materials Chemistry,
RWTH Aachen University, Max Planck Fellow, Max-Planck-Institute for Sustainable Materials
"Coating materials design"
Keynote lectures
Andre Anders
Plasma Engineering LLC, United States
Analysis of heating processes during film growth by sputter deposition
Ralf Bandorf
Fraunhofer IST, Germany
High Power Impulse Magnetron Sputtering: From Fundamental Concepts to Industrial Applications
Kazuyoshi Ueno
Institute of Multidisciplinary Science,
Yokohama National University
Interconnect Technology for Beyond 2nm Integration
Invited lectures
Gregory Abadias,
Université de Poitiers, France
Real-time monitoring of stress evolution during sputter-deposition of elemental and alloy thin films
Jón Tómas Guðmundsson
University of Iceland, Iceland
The high power impulse magnetron sputtering discharge
Elizabeth von Hauff
Fraunhofer FEP, Germany
Plasma process design and for sustainable solutions
Mati Horprathum
NECTEC, Thailand
Controlled Growth of Sculptured Thin Films via Sputtering-GLAD for Advanced Sensing Applications
Ching-Lien Hsiao
Linköping University, Sweden
Epitaxial growth of polar, semipolar, and nonpolar ScGaN films
Nobuhiko P. Kobayashi
University of California Santa Cruz, United States
Sputtering Atomic Layer Augmented Deposition (SALAD): A Versatile Approach
to Tailor Dielectric/Metal Systems for Cross-Disciplinary Applications
Hyo-Chang Lee
Korea Aerospace University (KAU)
Knowledge-based Radio-frequency plasma processing
Zong-Hong Lin
National Taiwan University
Triboelectrification at Solid–Liquid Interfaces: Surface Chemistry–Driven Charge Transfer for Self-Powered Nanosensing
Paul H. Mayrhofer
TU Wien, Austria
Defect- and Interface-Engineered Ceramic Thin Films for Extreme Environments
Martin Rudolph
Leibniz Institute of Surface Engineering (IOM), Germany
Manipulating spokes in magnetron sputtering discharges
Fan-Bean Wu
National United University, Taiwan
Evolution in Microstructure and Mechanical Properties of Magnetron Sputtering Refractory Metal Nitride Hard Coatings through Plasma Control
Industrial Presenters
ISSP2026 Exhibitors
7. Organizing Committees & Societies
ADVISORY COMMITTEE:
J. Alami (Mohammed VI Polytechnic University, Morocco)
A. Anders (Leibniz Institute of Surface Engineering, Germany)
H. Barankova (Uppsala University, Sweden)
R. Bandorf (Fraunhofer IST, Germany)
M. Bilek (The University of Sydney, Australia)
J.P. Chu (National Taiwan University of Science and Technology, Taiwan)
D. Depla (Ghent University, Belgium)
A. P. Ehiasarian (Sheffield Hallam University, UK)
J. T. Gudmundsson (University of Iceland, Iceland)
J.-L. He (Feng Chia University, Taiwan)
U. Helmersson (Linköping University, Sweden)
Y. Kuo (Texas A&M University, USA)
I. Petrov ( University of Illinois at Urbana Champaign, USA)
P.-K. Song (Pusan National University. Korea)
R. Snyders (University of Mons, Belgium)
Y. Tanimoto (KEK, Japan, International Relations Committee, JVSS)
B.K. Tay (Nanyang Tech. University)
J. Vlcek (University of West Bohemia, Czech Republic)
I. K. Han (President of Korean Vacuum Society (KVS))
S. F. Wang (President of Taiwan Association for Coating and Thin Film Technology (TACT))
Y. H. Chu (President of Taiwan Vacuum Society (TVS))
A. P. J. Stampfl (President of Vacuum Society of Australia (VSA))
S. Zhang (President of Thin Films Society (TFS))
K. L. M. Taaca (President of Vacuum Society of the Philippines (VSP))
ISSP 2026 EXECUTIVE COMMITTEE:
Conference chair:
J. Nomoto (AIST)
Vice chairs:
T. Kiba (Kitami Institute of Technol.)
N. Kihara (AGC Inc.)
Members:
Y. Gotoh (Kyoto University)
O. Nakagawara (I-PEX Piezo Solutions Inc.)
K. Ishibashi (ULVAC)
N. Itagaki (Kyushu University)
N. Kihara (AGC Inc.)
T. Shimizu (Tokyo Metropolitan University)
K. Kotera (Showa Shinku Co., Ltd.)
M. Shimizu (JX Advanced Metals Corp.)
Md. Suruz Mian (Tokai University)
H. Yasui (Industrial Research Institute Ishikawa)
M. Yamamoto (Kansai University)
K. Nagashima (Hokkaido University)
N. Noda (Secretariat)
ISSP 2026 LOCAL ARRANGEMENT COMMITTEE:
Chair:
Y. Gotoh (Kyoto University)
Members:
O. Nakagawara (I-PEX Piezo Solutions Inc.)
M. Yamamoto (Kansai University)
ISSP 2026 is supported by The World Leading Societies
Partnership by
